University of Siegen participated in the European research project, “From RF to MMW and THz Silicon System-on-Chip technologies”. 

Duration: 3 years (July 2011 – June 2014).
Project ended in December 2014 with 6 months project extension.

Project Overview

The RF2THz SiSoC project aims to develop silicon technology platforms for emerging RF, millimetre-wave (MMW) and THz consumer applications such as 77/120 GHz automotive radars, MMW imaging and sensing, fast measurement equipment, 60 GHz wireless networking and fast downloading systems, 400 Gbit/s fibre optics data communications systems, 4G photonic mobile communications and high performance RF wireless communication systems as well as two-way satellite communications systems. It also targets MMW and THz applications in health science, materials science, genetic screening, security and industrial automation.

The Catrene Profile can be found here.

Contribution University of Siegen

In RF2THz SiSoC project the University of Siegen was responsible for the realization of the 3D imaging demonstrator using the in the project designed and developed 240GHz Silicon Germanium (SiGe) transmitter and receiver chips.

Project Consortium

  • Advanced System Developments and User Services
  • Agilent Technologies
  • Alcatel Lucent
  • Astra SES
  • Robert Bosch
  • Bruco Integrated Circuits
  • ESIEE Paris
  • Fraunhofer Institute
  • Grenoble Institute of Technology
  • IEMN
  • IES
  • IHP
  • IMS
  • MASER Engineering
  • Micram Microelectronic
  • NXP Semiconductors
  • Salland Engineering
  • Silicon Radar
  • STMicroelectronics
  • SynView
  • Telecom Bretagne
  • TU Berlin
  • TU Delft
  • TU Dresden
  • TU Eindhoven
  • University of Saarland
  • University of Siegen
  • XMOD Technologies

Das EUREKA-Project RF2THzSiSoC was founded by Bundesministerium für Bildung und Forschung (Catrene CT-209).